| Digital IP Senior Verification Engineer | NXP | Austin, Office | — | 3 days ago |
| Principal Digital Design Engineer | NXP | Noida | — | 3 days ago |
| Web Manager – With Focus on New Product Launches content review and improvement | NXP | Guadalajara | — | 4 days ago |
| FPGA Digital Design Engineer (m/f/d) | NXP | Multiple Locations | — | 4 days ago |
| Plating Process Engineer | NXP | Kuala Lumpur | — | 4 days ago |
| Site HR Officer | NXP | Shenzhen | — | 4 days ago |
| Wire Bond Shift Assistant Engineer_輪班設備助理工程師 | NXP | Kaohsiung | — | 4 days ago |
| SEMICONDUCTOR ASSEMBLER 1 | NXP | Kuala Lumpur | — | 4 days ago |
| BGA FE Assembler | NXP | Kuala Lumpur | — | 4 days ago |
| BGA FE Wire Path cleaning operator | NXP | Kuala Lumpur | — | 4 days ago |
| wire bond operator | NXP | Kuala Lumpur | — | 4 days ago |
| SEMICONDUTOR ASSEMBLER 1 | NXP | Kuala Lumpur | — | 4 days ago |
| LEADED FE Assembler | NXP | Kuala Lumpur | — | 4 days ago |
| Equipment Setup Operator | NXP | Kuala Lumpur | — | 4 days ago |
| Leaded Front End Equipment Operator | NXP | Kuala Lumpur | — | 4 days ago |
| SEMICONDUCTOR ASSEMBLER I | NXP | Kuala Lumpur | — | 4 days ago |
| Engineering Technician | NXP | Malaysia | — | 4 days ago |
| Equipment Technician for Wire Bond | NXP | Kuala Lumpur | — | 4 days ago |
| Wire Bond Technician | NXP | Kuala Lumpur | — | 4 days ago |
| FE ASSY DIE BOND PROCESS TECHNICIAN | NXP | Kuala Lumpur | — | 4 days ago |